Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-10-17
2006-10-17
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S854000, C029S861000, C029S874000, C029S884000, 27, C439S065000
Reexamination Certificate
active
07120999
ABSTRACT:
A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.
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Nguyen Donghai D.
TraskBritt PC
Trinh Minh
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