Communications: electrical – Condition responsive indicating system – Specific condition
Reexamination Certificate
2006-02-28
2006-02-28
Hofsass, Jeffery (Department: 2636)
Communications: electrical
Condition responsive indicating system
Specific condition
C340S686100, C264S040100
Reexamination Certificate
active
07005998
ABSTRACT:
The present invention relates to a method of detecting a malfunction during a die clamping step in an injection molding machine. A reference pattern is taken which shows a relation between a die clamping force and a position of a movable platen when die clamping is normally carried out. One or more monitoring sections are set in advance with respect to that position on the basis of the reference pattern and an allowable limit value of a die clamping force in the respective monitoring sections is also set in advance in a form of a linear function of the position. The die clamping force is monitored in the respective monitoring section during a respective die clamping step and, when its value exceeds the allowable limit value, it is decided that a malfunction occurs and an alarm is issued.
REFERENCES:
patent: 5059370 (1991-10-01), Kojima
patent: 5346657 (1994-09-01), Hara et al.
patent: 5753153 (1998-05-01), Choi
patent: 5838571 (1998-11-01), Lewis
patent: 6093361 (2000-07-01), Schad
patent: 6482338 (2002-11-01), Levin et al.
patent: 2002/0158359 (2002-10-01), Matsubayashi et al.
patent: 01-306061 (1989-12-01), None
patent: 05-293862 (1993-11-01), None
patent: 9-85792 (1997-03-01), None
patent: 2001-30326 (2001-02-01), None
patent: 2002-248665 (2002-09-01), None
Japanese Office Action dated Sep. 27, 2005 for Appln. No. 2002-308602.
Abe Takeshi
Matsubayashi Haruyuki
Yamazaki Takashi
Bugg George
Hofsass Jeffery
Pillsbury Winthrop Shaw & Pittman LLP
Toshiba Machine Co. Ltd.
LandOfFree
Malfunction-detection method during die clamping step in... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Malfunction-detection method during die clamping step in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Malfunction-detection method during die clamping step in... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3684893