Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2006-06-06
2006-06-06
Nguyen, Vinh P. (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
Reexamination Certificate
active
07057408
ABSTRACT:
A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
REFERENCES:
patent: 3996517 (1976-12-01), Fergason et al.
patent: 4864227 (1989-09-01), Sato
patent: 4992659 (1991-02-01), Abraham et al.
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 405121498 (1993-05-01), None
Dietrich Claus
Fehrmann Frank
Fleischer Hans-Jürgen
Kanev Stojan
Kiesewetter Jörg
Baker & Botts LLP
Nguyen Vinh P.
SUSS MicroTec Test Systems (GmbH)
Tejwani Manu J.
LandOfFree
Method and prober for contacting a contact area with a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and prober for contacting a contact area with a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and prober for contacting a contact area with a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3678930