Method and apparatus for forming a thick film integrated circuit

Details Method and apparatus for forming a thick film integrated circuit Method and apparatus for forming a thick film integrated circuit

1988-09-20

1989-09-19

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427256, 118696, 118697, B05C 1100, B05D 512

Patent

active

048680079

ABSTRACT:
A method and apparatus for forming thick-film integrated circuits provides a secondary up-down mover which prevents a nozzle from being damaged. A spring is applied to the secondary mover as a shock-absorber acting when the nozzle descends to a substrate. A restrictor is provided which restricts the action of the secondary up-down mover by solenoid action, such that the nozzle is accurately ascended from the substrate by a predetermined dimension with the secondary up-down mover in the restricted condition.

REFERENCES:
patent: 2264632 (1941-12-01), Gerlitzki
patent: 4569305 (1986-02-01), Ferri
patent: 4572103 (1986-02-01), Engel
patent: 4661368 (1987-04-01), Rohde
patent: 4753824 (1988-06-01), Toda

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