Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate
2006-06-06
2006-06-06
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
C257S723000, C257S758000
Reexamination Certificate
active
07057279
ABSTRACT:
A high frequency module device having a high frequency circuit block unit including a passive device. A plural number of unit wiring layers, each formed by an insulating layer, having a passive device unit in its portion, and by a pattern wiring, are layered on a dummy substrate, and are released from the dummy substrate to form the high frequency circuit block unit (2), which is mounted on a motherboard (3). The major surfaces of the respective unit wiring layers are planarized. The passive device unit and the pattern wiring, formed on the major surface of each unit wiring layer in the high frequency circuit block unit (2), can be formed with high accuracy to improve high frequency characteristics. The high frequency circuit block unit (2) is not in need of a base substrate, thus achieves reduction in size and cost.
REFERENCES:
patent: 5231751 (1993-08-01), Sorce
patent: 5674784 (1997-10-01), Jang et al.
patent: 6583364 (2003-06-01), Kurita et al.
patent: 2001/0015327 (2001-08-01), Kitamura et al.
patent: 540451 (1991-10-01), None
patent: 2000-36238 (2001-02-01), None
patent: 2001-144218 (2001-05-01), None
patent: 2001-298274 (2001-10-01), None
Depke Robert J.
Pham Long
Sony Corporation
Trexler, Bushnell Giangiorgi, Blackstone & Marr, Ltd.
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