Semiconductor device and package for containing...

Details Semiconductor device and package for containing... Semiconductor device and package for containing...

2006-06-13

2006-06-13

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257S680000, C257S710000

Reexamination Certificate

active

07061064

ABSTRACT:
To enable to downsize a package for containing a solid-state imaging element relative to a solid-state imaging element having the same size and accordingly, downsize a solid-state imaging device for containing the solid-state imaging element thereto, further, downsize an apparatus such as a video camera or a still camera using the solid-state imaging device, there is provided a package for containing semiconductor element comprising a package having a recess portion for containing a semiconductor element, and a pair of positioning holes and a pair of attaching holes respectively provided at a pair of opposed side portions of the recess portion at surfaces of the package, wherein a line connecting the pair of positioning holes and a line connecting the pair of attaching holes are intersected with each other substantially at a center of the package.

REFERENCES:
patent: 5371397 (1994-12-01), Maegawa et al.
patent: 5448114 (1995-09-01), Kondoh et al.
patent: 5519252 (1996-05-01), Soyano et al.
patent: 5686758 (1997-11-01), Arai et al.
patent: 5920119 (1999-07-01), Tamba et al.
patent: 6281579 (2001-08-01), Siu
patent: 6384473 (2002-05-01), Peterson et al.

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