Method of producing ceramic multilayer substrate

Details Method of producing ceramic multilayer substrate Method of producing ceramic multilayer substrate

2006-02-28

2006-02-28

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S850000, C029S851000, C156S079000

Reexamination Certificate

active

07004984

ABSTRACT:
After a resistor and/or a capacitor are simultaneously fired on a fired ceramic core substrate to be fired, the fired resistor and/or the fired capacitor is trimmed so that the resistance and the capacitance are adjusted. Thereafter, an after-lamination green sheet is laminated onto the ceramic core substrate and the produced after-lamination substrate is fired at a temperature which is lower than the sintering temperature of the resistor and the dielectric. Thus, the sintered resistor and dielectric can be prevented from being softened and melted when the after-lamination substrate is fired. Moreover, the resistance and the capacitance accurately adjusted by trimming before the after-lamination substrate is fired are not changed by the firing.

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patent: 4882650 (1989-11-01), Maher et al.
patent: 01-295483 (1989-11-01), None
patent: 09-092983 (1997-04-01), None

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