Method of manufacturing chip-type ceramic electronic component

Details Method of manufacturing chip-type ceramic electronic component Method of manufacturing chip-type ceramic electronic component

2006-11-28

2006-11-28

Chang, Richard (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S611000, C029S612000, C338S195000, C338S0220SD

Reexamination Certificate

active

07140097

ABSTRACT:
A method of manufacturing a chip-type ceramic electronic component having stable electrical properties and excellent mechanical strength includes the steps of providing a plurality of green sheets having predetermined cutting positions, coating inorganic paste including the same ceramic material as that included in ceramic green sheets, and an inorganic material having higher resistivity than that of the ceramic material, on a region of each ceramic green sheet, and laminating a predetermined number of the ceramic green sheets to form a ceramic laminated product. Then, the ceramic laminated product is cut into a chip at the predetermined cutting positions and sintered to form a ceramic sintered compact, and external electrodes are formed at both ends of the ceramic sintered compact.

REFERENCES:
patent: 6588094 (2003-07-01), Furukawa et al.
patent: 2000-091105 (2000-03-01), None
patent: 2000-106304 (2000-04-01), None
patent: 2000-124006 (2000-04-01), None
patent: 2000-124007 (2000-04-01), None

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