Electrodeposition coating method using lead-free cationic...

Details Electrodeposition coating method using lead-free cationic... Electrodeposition coating method using lead-free cationic...

2006-08-22

2006-08-22

Mayekar, Kishor (Department: 1753)

Chemistry: electrical and wave energy

Processes and products

Electrophoresis or electro-osmosis processes and electrolyte...

C204S504000, C204S506000, C204S489000, C523S415000

Reexamination Certificate

active

07094324

ABSTRACT:
With the use of a lead-free cationic electrodeposition coating composition containing a sulfonium-modified epoxy resin, an amine-modified novolak-type epoxy resin, and a blocked isocyanate curing agent as a binder resin, wherein the content of volatile organic components is 1% by weight or less, the coating liquid conductivity is 1000 to 2500 μS/cm, and the minimum film-forming temperature of the coated layer electrodeposited on an object to be coated is 20 to 35° C., electrodeposition coating is carried out at or above the temperature which is lower by 2° C. than the minimum film-forming temperature and at or below the temperature which is higher by 6° C. than the minimum film-forming temperature.

REFERENCES:
patent: 2002/0183421 (2002-12-01), Kojima et al.
patent: 2003/0096906 (2003-05-01), Tazzia et al.
patent: 07-286297 (1995-10-01), None
patent: 07-286297 (1995-10-01), None
patent: 09-235495 (1997-09-01), None
patent: 2000-038527 (2000-02-01), None
patent: 2000-204299 (2000-07-01), None
patent: 2000-204299 (2000-07-01), None

Affiliated with

Also associated with

Rating

Electrodeposition coating method using lead-free cationic... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrodeposition coating method using lead-free cationic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrodeposition coating method using lead-free cationic... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3672178