Curable compounds containing reactive groups:...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C524S236000, C525S043000

Reexamination Certificate

active

07057264

ABSTRACT:
This invention is directed to compounds that can be used as antioxidants for exposed metal surfaces, and also as adhesion promoters for adhesive, coating or encapsulant resins that are applied to the metal substrates. These compounds include triazine or isocyanurate compounds bearing reactive or polymerizable functional groups, polyfunctional cyanate esters, and polyfunctional blocked-isocyanates.

REFERENCES:
patent: 3004896 (1961-10-01), Heller
patent: 3493539 (1970-02-01), Skouitchi et al.
patent: 4428987 (1984-01-01), Bell et al.
patent: 4448847 (1984-05-01), Bell et al.
patent: 4842946 (1989-06-01), Foust et al.
patent: 4981994 (1991-01-01), Jackson
patent: 5122858 (1992-06-01), Mahulikar et al.
patent: 5130402 (1992-07-01), Akiyama et al.
patent: 5143785 (1992-09-01), Pujol et al.
patent: 5449951 (1995-09-01), Parthasarathi et al.
patent: 5723523 (1998-03-01), Engelhardt et al.
patent: 5741544 (1998-04-01), Mahulikar
patent: 6057402 (2000-05-01), Zhou et al.
patent: 6225378 (2001-05-01), Wang et al.
patent: 6391948 (2002-05-01), Clark et al.
patent: 6482523 (2002-11-01), Morikawa et al.
patent: 6716891 (2004-04-01), Meisenburg et al.
patent: 6794442 (2004-09-01), Colyer et al.
patent: 2001/0036985 (2001-11-01), Lee et al.
patent: VV M 814/6.76 (1985-11-01), None
patent: 44 36 355 A 1 (1995-06-01), None
patent: 197 48 658 (1998-05-01), None
patent: 0 251 490 (1987-05-01), None
patent: 0 251 490 (1987-05-01), None
patent: 0 285 266 (1988-03-01), None
patent: 0 285 266 (1988-03-01), None
patent: 0 285 266 (1988-04-01), None
patent: 0 176 555 (1988-12-01), None
patent: 0 431 868 (1990-03-01), None
patent: 0 659 860 (1995-06-01), None
patent: 0 736 577 (1996-03-01), None
patent: 0 970 946 (1999-01-01), None
patent: 1 033 590 (2000-02-01), None
patent: 1 033 590 (2000-02-01), None
patent: 1325404 (1962-06-01), None
patent: 1330378 (1962-06-01), None
patent: 1330379 (1962-06-01), None
patent: 2122465 (1972-01-01), None
patent: 1995 007 1986 (1995-03-01), None
patent: 1996 017 0111 (1996-07-01), None
patent: 1996 020 5143 (1996-08-01), None
patent: HEI 11-1999-195358 (1999-07-01), None
patent: HEI 11-1999-196722 (1999-07-01), None
patent: HEI 11-1999-285892 (1999-10-01), None
patent: 2000096032 (2000-04-01), None
patent: 2001 244 383 (2001-07-01), None
patent: WO 01/58227 (2001-08-01), None
Parthasarathi, Arvind et al.: “Leadframe Treatment To Prevent Delamination in Plastic Packages”; Pub. # 14-115; 1994, 1998 Rogers Corporation.
Dai, Qinpin et al.: “SERS and IR Studies of Polymerization of an Epoxy Compound on Top of Benzotriazole Absorbed on Copper”; Spectroscopy Letter, (28)1, 43-54 (1995); Marcel Dekker, Inc. 1995.
Fournier, T. et al.: “Femtosecond laser studies of excited state intramolecular proton transfer in an ultraviolet—filter molecule”; Chem. Phys. Lett. 2000, 325 (1,2,3), 171-175 (Eng), Elsevier Science B.V.; CA Selects: Siloxanes & Silicones, Issue 23, 2000.
Huneke, James T. et al.: “Die Attach Adhesion on Leadframes Treated with Antioxidants”; Oct. 1997 IEEE/CPMT Electronic Packaging Technology Conf.-Singapore.
Ostrauskaite, Jolita et al.: “Synthesis and cationic polymerization of 5-(2,3-expoxypropyl)amino-2-phenyl-1,2,3-benzotriazole”; European Polymer Journal 36 (2000) 2499-2504; Kaunas Univ. of Tech., Kaunas, Lithuania.
Kim, Taek Hyeon et al.: “Melt Free-Radical Grafting of Hindered Phenol Antioxidant onto Polyethylene”; Journal of Applied Polymer Science, vol. 77, 2968-2973 (2000); Kwangju, Korea; John Wiley & Sons, Inc. Pub.
Kim, Taek Hyeon et al.: “Free Radicals Grafting of Hindered Phenol Antioxidants Onto Low Molecular Weight PE”; Polymer Preprints 2000, 41(2), 1237; Kwangju, Korea.
Bartus, Jan et al.: “Functional Polymers. 63.* Emulsion Copolymerization of Maleimide Type Monomers With Acrylonitrile And Styrene In ABS Latexes”; J.M.S.-Pure Appl. Chem., A36(3), pp. 355-371 (1999); 1999 by Marcel Dekker, Inc.
Stoeber, Lutz et al.: “Functional Polymers. 64. Potasium Ionization Of Desorbed Species (K*IDS) Of 2(2-Hydroxyphenyl)2H-Benzotriazoles”; J.M.S.-Pure Appl. Chem., A37(11), pp. 1269-1300 (2000); 2000 by Marcel Dekker, Inc.
Stoeber, Lutz et al.: “Functional Polymers 65. Synthesis And Brief Characterization of Surface Active 2(2-Hydroxphenyl)2H-Benzotriazole Ultraviolet Stabilizers”; J.M.S.-Pure Appl. Chem., A37(9), pp. 943-970 (2000); 2000 by Marcel Dekker, Inc.
No Author: Graphs: “A Benzotriazole Family”; “p-Polyhydroxystyrene Family”; TriQuest, LP.
ACS Registry Database Structure Search, 54 Entries , 66 Pages.
Kim, H. et al.: “Corrosion protection and adhesion promotion for polyimide/copper system using silane-modified polymeric materials”; Polymer 41 (2000) 6553-6561, Seoul South Korea.
Yu, J. et al.: “Miscibility of Polyimide with Polymeric Primer and Its Influence on Adhesion of Polyimide to the Primed Copper Metal: Effect of Precursor Origin”; Journal of Polymer Science: Part B: Polymer Pysics, vol. 37, 2806-2814 (1999); Pub. John Wiley & Sons, Inc.
Ishida, H. et al.: “Modified Imidazoles: Degradation Inhibitors and Adhesion Promoters for Polyimide Films on Copper Substrates”; J. Adhesion, 1991, vol. 36, pp. 177-191; 1991 Gordon and Breach Science Publishers S.A., U.K.
Parthasarathi, Arvind et al.: “Leadframe Treatment To Prevent Delamination In Plastic Packages”; Pub. # 14-115; 1994, 1998 Rogers Corporation.
Dai, Qinpin et al.: “SERS and IR Studies of Polymerization of an Epoxy Compound on Top of Benzotriazole Adsorbed on Copper”; Spectroscopy Letter, 28(1), 43-54 (1995); Marcel Dekker, Inc. 1995.
Xue, Gi et al.: “Stable SERS Substrates Used for In Situ Studies of the Polymer-Metal Interface at Elevated Temperature”; Macromolecules 1994, 27, 809-813; 1994 American Chemical Society.
Poling, G.W.: “Reflection Infra-Red Studies Of Films Formed By Benzotriazole On Cu*”; Corrosion Science, 1970, vol. 10, pp. 359 to 370, Pergamon Press, Printed in Great Britain.
Xue, Gi et al.: “SERS, XPS, and Electroanalytical Studies of the Chemisorption of Benzotriazole on a Freshly Etched Surface and and an Oxidized Surface of Copper”; J. Phys. Chem. 1991, 95, 7380-7384.
Yoshida, Shuji et al.: “A FT-IR Reflection-Absorption Spectroscopic Study of an Epoxy Coating on Imidazole-Treated Copper”; J. Adhesion, 1984, vol. 16, pp. 217-232; 1984 Gordon & Breach Science Publishers, Inc., U.K.
Mansfield, Florian et al.: Technical Note “Benzotriazole as Corrosion Inhibitor for Copper II. Acid NaC1 Solutions”; Corrosion-Nace, North American Rockwell Science Center, Thousand Oaks, CA; Submitted for publication Aug., 1972.
Vogt, Jurgen: “Thermoset Matrices for Structural Adhesives: Imidazole-Catalysed Curing of Epoxy Resins”; J. Adhesion, 1987. vol. 22, pp. 139-151, 1987 Gordon & Breach Science Publishers, Inc., U.K.
Cho, Kilwon et al.: “Effect of the microstructure of copper oxide on the adhesion behavior of epoxy/copper leadframe joints”; J. Adhesion Sci. Technol, vol. 14, No. 11, pp. 1333-1353 (2000).
Lee, H. Y.: “Failure paths of the Cu-based leadframe/EMC joints”; Materials Science and Engineering A311 (2001) 217-225; 2001 Elsevier Science B.V.
Chong, Chai Tai et al.: “Investigation on the Effect of Copper Leadframe Oxidation on Package Delamination”; 1995 IEEE.
Huang, Yizhe Elisa et al.: “Effect Of Solder Reflow Temperature Profile On Plastic Package Delamination”; 1998 IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium.
Kang, Teck-Gyu et al.: “Characterization of Oxidized Copper Leadframes and Copper/Epoxy Molding Compound Interface Adhesion in Plastic Package”; 1998 IEEE.
Schmidt, R. et al.: “Investigation of the Adhesion Strength between Molding Compound and Leadframe at Higher Temperatures”; 1998 IEEE/CPMT Electronics Packaging T

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Curable compounds containing reactive groups:... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Curable compounds containing reactive groups:..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Curable compounds containing reactive groups:... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3670899

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.