Self alignment features for an electronic assembly

Details Self alignment features for an electronic assembly Self alignment features for an electronic assembly

2006-11-14

2006-11-14

Tran, Minhloan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000, C257S778000, C257S786000, C257SE23021, C257SE23023, C257SE23069

Reexamination Certificate

active

07135771

ABSTRACT:
Some embodiments of the present invention relate to an electronic assembly that includes a substrate and a die. The electronic assembly further includes an alignment bump on one of the die and the substrate and a group of mating bumps on the other of the die and the substrate. The group of mating bumps is positioned such that if the alignment bump engages each of the mating bumps, the die is appropriately positioned relative to the substrate at that location where the alignment bump engages the group of mating bumps. In some embodiments, the alignment bump extends from the substrate while in other embodiments the alignment bump extends from the die. The alignment bump on the substrate (or die) may be part of a plurality of alignment bumps such that each alignment bump engages a different group of mating bumps on the die (or substrate).

REFERENCES:
patent: 6552425 (2003-04-01), Yan et al.
patent: 6613662 (2003-09-01), Wark et al.
patent: 6830463 (2004-12-01), Keller
McGovern, L P., et al., “High throughput low cost flip chip on board assembly processing”,Electronic Packaging&Production, 38(2), (Feb. 1998),68-76.
Wong, C P., et al., “High performance no flow underfills for low-cost flip-chip applications”,Proceedings—47th Electronic Components and Technology Conference—IEEE, (May 18-21, 1997),850-858.

Affiliated with

Also associated with

Rating

Self alignment features for an electronic assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self alignment features for an electronic assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self alignment features for an electronic assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3669989