Polishing pad and method of fabricating semiconductor...

Abrading – Flexible-member tool – per se – Interrupted or composite work face

Reexamination Certificate

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C451S041000, C451S286000, C451S287000, C451S288000, C451S526000, C451S529000, C451S539000

Reexamination Certificate

active

07121938

ABSTRACT:
It is provided a polishing pad of novel construction capable of controlling actively and efficiently a slurry flow during polishing a surface of a semiconductor substrate, such as a wafer, thus making it possible to precisely and stably performing a desired polishing process. Onto a surface of a pad substrate12of synthetic resin material, formed is a groove16extending approximately circumferentially. An inner circumferential wall surface20and an outer circumferential wall surface22are made parallel to each other and slant with respect to a center axis18of the pad substrate12.

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patent: 6238271 (2001-05-01), Cesna
patent: 6364749 (2002-04-01), Walker
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patent: 2000-354952 (2000-12-01), None
patent: 2001-18165 (2001-01-01), None
patent: A 2001-18164 (2001-01-01), None
patent: 2002-011630 (2002-01-01), None

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