Method for mounting an electronic part by solder position...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S721000, C029S742000, C029S746000, C029S833000, C029S834000

Reexamination Certificate

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07059043

ABSTRACT:
An electronic parts mount apparatus for taking out electronic parts from a parts supply section3by a transfer head9and transporting and mounting the electronic parts to and on a board2has a board recognition camera15moving independently of the transfer head9and advancing to and retreating from the board2positioned on a transfer passage1for picking up an image of the board2to detect the position thereof. The image pickup step of the board2by the board recognition camera15and the parts taking out step in the parts supply section by the transfer head9are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

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patent: 2002/0046462 (2002-04-01), Inoue et al.
patent: 2001-185899 (2001-07-01), None
patent: 2002-84097 (2002-03-01), None

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