Method of manufacturing a device

Details Method of manufacturing a device Method of manufacturing a device

2006-11-07

2006-11-07

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S606000, C029S832000, C029S846000, C029S850000, C029S854000, C029S885000, C174S260000, C427S129000, C427S130000

Reexamination Certificate

active

07131194

ABSTRACT:
Wirings2B1are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate5having a predetermined repellent property, bonding an insulating layer4B1to the wirings2B1with an adhesive material3B1therebetween, peeling and removing the provisional substrate5,and bonding and fixing the wirings2B1together with the insulating film4B1to a main substrate1by an adhesive material3B1.

REFERENCES:
patent: 6002592 (1999-12-01), Nakamura et al.
patent: 6020048 (2000-02-01), Oka et al.
patent: 6143116 (2000-11-01), Hayashi et al.
patent: 6197407 (2001-03-01), Andou et al.
patent: 6596406 (2003-07-01), Ikeda et al.
patent: 03-270292 (1991-12-01), None
patent: 05-090750 (1993-04-01), None
patent: 06053654 (1994-02-01), None
patent: 06-199032 (1994-07-01), None
patent: 10-064331 (1998-03-01), None
patent: 11-163499 (1999-06-01), None
“Development of core-less substrate for multi wiring layers”; Maehara, M.; Kato, I.; Akimoto, S.; Okuma, T.; Iino, R.; Tsukamoto, T.; Electronics Packaging Technology Conference, 2002. 4th; Dec. 10-12, 2002; pp. 280-284.
Communication from Japanese Patent Office regarding counterpart application.

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