Light emitting diodes packaged for high temperature operation

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S098000, C257S099000

Reexamination Certificate

active

07098483

ABSTRACT:
In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.

REFERENCES:
patent: 4886709 (1989-12-01), Sasame et al.
patent: 5122781 (1992-06-01), Saubolle
patent: 5140220 (1992-08-01), Hasegawa
patent: 5581876 (1996-12-01), Prabhu et al.
patent: 5725808 (1998-03-01), Tormey et al.
patent: 5745624 (1998-04-01), Chan et al.
patent: 5847935 (1998-12-01), Thaler et al.
patent: 5953203 (1999-09-01), Tormey et al.
patent: 5977567 (1999-11-01), Verdiell
patent: 6045240 (2000-04-01), Hochstein
patent: 6220722 (2001-04-01), Begemann
patent: 6325524 (2001-12-01), Weber et al.
patent: 6376268 (2002-04-01), Verdiell
patent: 6428189 (2002-08-01), Hochstein
patent: 6455930 (2002-09-01), Palanisamy et al.
patent: 6518502 (2003-02-01), Hammond et al.
patent: 6634750 (2003-10-01), Neal et al.
patent: 6634770 (2003-10-01), Cao
patent: 6692252 (2004-02-01), Scott
patent: 2002/0034834 (2002-03-01), Verdiell
patent: 2002/0163006 (2002-11-01), Yoganandan et al.
patent: 2002/0175621 (2002-11-01), Song et al.
patent: 2002/0176250 (2002-11-01), Bohler et al.
patent: 2003/0057421 (2003-03-01), Chen
patent: 2004/0026706 (2004-02-01), Bogner et al.
patent: 2000-294701 (2000-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Light emitting diodes packaged for high temperature operation does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Light emitting diodes packaged for high temperature operation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light emitting diodes packaged for high temperature operation will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3662316

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.