Lapping slurry compositions with improved lap rate

Details Lapping slurry compositions with improved lap rate Lapping slurry compositions with improved lap rate

1988-09-09

1989-09-19

Lieberman, Paul

Abrasive tool making process, material, or composition

Miscellaneous

51307, 51309, B24D 300

Patent

active

048677574

ABSTRACT:
A concentrated lapping composition having the following makeup:

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patent: 4769046 (1988-09-01), Senda et al.
patent: 4773920 (1988-09-01), Chasman et al.
"Abrasive Technology for Wafer Lapping", by J. A. Dudley, Microelectronic Manufacturing and Testing, Mar. 1986.
"How Users Can Optimize Machine Performance in Production Lapping Operations", by Dr. D. Rostoker, Microelectronic Manufacturing and Testing, pp. 9-10, May 1987.
"Crystallographic Damage to Silicon", by Typical Slicing Lapping, and Polishing Operations, by T. M. Buck & R. L. Meek, NBS Special Publication No. 337, pp. 419-430.

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