Resin composition with high thermal conductivity and method...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – At least one aryl ring which is part of a fused or bridged...

Reexamination Certificate

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Details

C310S043000, C310S235000, C310S272000, C359S896000, C523S215000, C523S307000, C524S440000, C524S441000, C524S495000

Reexamination Certificate

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06995205

ABSTRACT:
A resin composition having high thermal conductivity and excellent moldability and a method of producing the same is provided. The composition includes 40 vol % or more of a matrix resin, 10 to 55 vol % of a thermally conductive filler dispersed in the matrix resin and the balance of a low-melting point alloy connecting the thermally conductive filler to each other and having a melting point not higher than 500° C. The proportion of the volume ratio of the low-melting point alloy to that of the thermally conductive filler is set in a range from 1/30 to 3/1.

REFERENCES:
patent: 6342680 (2002-01-01), Nakagawa et al.
patent: 6-196884 (1994-07-01), None
patent: 10-237331 (1998-09-01), None
patent: 11-255904 (1999-09-01), None
patent: 2000-357413 (2000-12-01), None
patent: 2001-72775 (2001-03-01), None
patent: 2001-200163 (2001-07-01), None
patent: 2001-200225 (2001-07-01), None
patent: 2002-212443 (2002-07-01), None

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