All ceramic surface mount sip and dip networks having spacers an

Details All ceramic surface mount sip and dip networks having spacers an All ceramic surface mount sip and dip networks having spacers an

1995-05-19

1997-04-15

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174138G, 257692, 257693, 338277, 338319, 338320, 338313, 361772, H01R 900

Patent

active

056216190

ABSTRACT:
A resistor network is disclosed which is suited for surface mount which does not incorporate wire terminations. The network is fabricated entirely from cermet, ceramic, and solder, yet will absorb thermal stresses normally associated with circuitry energization when properly mounted upon a substrate. This is accomplished by controlling the formation of solder bumps and simultaneously controlling the mounted distance between those bumps and a wiring substrate upon which the network is mounted. Additionally, the network may be formed to be either a SIP or DIP configuration, depending upon whether an additional groove is incorporated into the termination side of the substrate. Two alternative embodiments are also disclosed which incorporate various features of the invention.

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