Wafer processing method

Details Wafer processing method Wafer processing method

2006-11-14

2006-11-14

Eley, Timothy V. (Department: 3724)

Abrading

Abrading process

Glass or stone abrading

C451S055000, C438S033000, C438S462000, C438S463000, C438S464000

Reexamination Certificate

active

07134943

ABSTRACT:
A wafer processing method for dividing a wafer having optical devices that are formed in a plurality of areas sectioned by dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising a laser beam application step of applying a laser beam capable of passing through the wafer along the dividing lines to form deteriorated layers having a predetermined depth from the back surface of the wafer; a protective sheet affixing step of affixing a protective sheet to the front surface of the wafer having the deteriorated layers formed therein; a dividing step of dividing the wafer having the protective sheet affixed to the front surface along the deteriorated layers; and a grinding step of grinding the back surface of the wafer divided along the deteriorated layers in a state of the protective sheet being affixed to the wafer, to remove the deteriorated layers.

REFERENCES:
patent: 5238876 (1993-08-01), Takeuchi et al.
patent: 5527744 (1996-06-01), Mignardi et al.
patent: 5693182 (1997-12-01), Mathuni
patent: 6337258 (2002-01-01), Nakayoshi et al.
patent: 6420245 (2002-07-01), Manor
patent: 6562698 (2003-05-01), Manor
patent: 6583032 (2003-06-01), Ishikawa et al.
patent: 6756562 (2004-06-01), Kurosawa et al.
patent: 6770544 (2004-08-01), Sawada
patent: 6827636 (2004-12-01), Yamada
patent: 6939785 (2005-09-01), Kajiyama et al.
patent: 6-120334 (1986-01-01), None
patent: 2002-192367 (2002-07-01), None
Copy of copending application, filed concurrently (Sep. 9, 2004) entitled “Wafer Processing Method” and claiming JP 2003-319824 priority.

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