Packaging platform having an adjustable thickness

Details Packaging platform having an adjustable thickness Packaging platform having an adjustable thickness

2006-12-12

2006-12-12

Gehman, Byron P. (Department: 3728)

Special receptacle or package

Holder for a removable electrical component

For a semiconductor wafer

C206S303000, C206S454000, C220S004210, C220S004270

Reexamination Certificate

active

07147107

ABSTRACT:
A platform (40) has a rigid body with an adjustable thickness (t) to selectively occupy any remaining space within a container (20) used for packaging items such as semiconductor wafers (22). The platform (40) in one example has a first portion (42) and a second portion (44). Adjusting the positions of the first and second portions (42, 44) relative to each other selectively varies the thickness (t) of the platform (40) to achieve the desired thickness.

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