Semiconductor package having a resin cap member

Details Semiconductor package having a resin cap member Semiconductor package having a resin cap member

2006-06-13

2006-06-13

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S788000

Reexamination Certificate

active

07060530

ABSTRACT:
A semiconductor package has a base member made of a wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity. The curable-resin cap member is fixed onto the wall member by the curing process for the curable-resin cap member.

REFERENCES:
patent: 5795799 (1998-08-01), Hosoya
patent: 6011303 (2000-01-01), Tanaka et al.
patent: 6313525 (2001-11-01), Sasano
patent: 6432737 (2002-08-01), Webster
patent: 6518501 (2003-02-01), Kawahara et al.
patent: 2001/0045643 (2001-11-01), Katoh et al.
patent: 2000-286354 (2000-10-01), None

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