Method of electrically connecting a microelectronic component

Details Method of electrically connecting a microelectronic component Method of electrically connecting a microelectronic component

2006-11-21

2006-11-21

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000, C174S267000, C174S260000, C029S830000, C257SE23078, C257SE23069

Reexamination Certificate

active

07138299

ABSTRACT:
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

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