Polishing pad having a groove arrangement for reducing...

Details Polishing pad having a groove arrangement for reducing... Polishing pad having a groove arrangement for reducing...

2006-10-24

2006-10-24

Shakeri, Hadi (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S527000, C451S285000

Reexamination Certificate

active

07125318

ABSTRACT:
A polishing pad (200) that includes a polishing layer (204) having a polishing region (208) for polishing a wafer (220). The polishing layer includes a set of inflow grooves (232) that extend into the polishing region and a set of outflow grooves (236) that extend out of the polishing region. The inflow and outflow grooves cooperate with one another to enhance the utilization of a polishing slurry during polishing of the wafer.

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