Method for manufacturing laminated electronic component

Details Method for manufacturing laminated electronic component Method for manufacturing laminated electronic component

2006-06-27

2006-06-27

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Condenser or capacitor

C427S080000, C427S081000, C029S025410, C029S025420

Reexamination Certificate

active

07067173

ABSTRACT:
Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.

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patent: 0 764 618 (1997-03-01), None
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Copy of Japanese Examination Report dated Oct. 5, 2004 (and English translation of same).

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