Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2006-05-16
2006-05-16
Tugbang, A. Dexter (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C029S843000, C029S844000, C174S263000, C228S248100, C257S737000, C361S764000, C438S012000, C438S013000
Reexamination Certificate
active
07043830
ABSTRACT:
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed on the wafer. Solder paste is deposited in the apertures and reflowed to form discrete conductive elements for attachment of the electronic devices to higher level circuit structures. The wafer is then divided or “singulated” to provide individual semiconductor dice having their active surfaces covered by the sealing layer. In this manner, the sealing layer initially acts as a stencil for forming the discrete conductive elements and subsequently forms a chip scale package structure to protect the semiconductor dice from the environment.
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Micro)n Technology, Inc.
Phan Tim
TraskBritt PC
Tugbang A. Dexter
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