Method and system for aligning IC die to package substrate

Details Method and system for aligning IC die to package substrate Method and system for aligning IC die to package substrate

2006-05-30

2006-05-30

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

C438S975000, C438S462000, C257S797000, C257SE23179

Reexamination Certificate

active

07052968

ABSTRACT:
In a method and system for placing an IC (integrated circuit) die onto a package substrate, a first reference is determined after locating a first fiducial on the package substrate, and a second reference is determined after locating a second fiducial on the package substrate. The IC die is placed onto the package substrate to be aligned with respect to the first and second references of the first and second fiducials that are comprised of a plurality of markings such as a plurality of dots.

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