Semiconductor device with conductors on stepped substrate having

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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257306, 257412, 257752, H01L 2968

Patent

active

054204623

ABSTRACT:
An element separating oxide film is formed on a P-type semiconductor substrate by means of a selective oxidation method, and then a gate oxide film is formed on the element separating oxide film by a thermal oxidation method. A gate electrode film made of an N-type polysilicon material is formed so as to extend along a step portion of the element separating oxide film on the semiconductor substrate. The upper surface of the gate electrode film is flattened by means of a surface polishing method. Then, isotropic etching is performed by using a resist pattern as a mask, thereby forming a gate electrode. Since in the method the upper surface of the gate electrode film in the flattened, the semiconductor substrate is prevented from being subject to over-etching when a gage electrode is formed, so that the changes of characteristics of MOS transistors are prevented whose gate insulative films have been becoming thinner as their elements have been finer.

REFERENCES:
patent: 4879257 (1989-11-01), Patrick
patent: 5200635 (1993-04-01), Kaga et al.
patent: 5218219 (1993-06-01), Ajika et al.
patent: 5256892 (1993-10-01), Yoshida

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