Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-08-22
2006-08-22
Lee, Hsien-Ming (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000, C438S637000, C438S700000
Reexamination Certificate
active
07094629
ABSTRACT:
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
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Lee Hsien-Ming
Oliff & Berridg,e PLC
Seiko Epson Corporation
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