Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-06-27
2006-06-27
Vigushin, John B. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S777000, C361S778000, C257S503000, C257S665000, C257S691000, C257S728000, C257S784000, C257S786000, C330S068000
Reexamination Certificate
active
07068521
ABSTRACT:
In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
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Adachi Tetsuaki
Hase Eiichi
Kagaya Osamu
Kikuchi Sakae
Kohjiro Iwamichi
Hitachi Tohbu Semiconductor, Ltd.
Mattingly ,Stanger ,Malur & Brundidge, P.C.
Renesas Technology Corp.
Vigushin John B.
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