Method of manufacturing an ink-jet printhead

Details Method of manufacturing an ink-jet printhead Method of manufacturing an ink-jet printhead

2006-08-08

2006-08-08

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S890100, C029SDIG016, C347S065000, C438S021000, C438S734000, C216S027000, C216S067000, C216S079000

Reexamination Certificate

active

07086142

ABSTRACT:
A method of manufacturing an ink-jet printhead, including forming an insulation film on a substrate, depositing a metal layer onto said insulation film and patterning said metal layer to form a heater, forming an electrical wire on said substrate, etching said substrate at a predetermined depth from a top surface of said substrate in a direction perpendicular to a major surface of said heater to form a narrow passage, depositing an ink chamber barrier layer on said top surface of said substrate and patterning said ink chamber barrier layer to form an ink chamber, stacking a nozzle plate having a nozzle on said ink chamber barrier layer and disposed on an upper portion of said ink chamber barrier layer, and applying predetermined pressure and temperature onto said nozzle plate to bond said nozzle plate and said substrate, and etching said substrate from a bottom surface thereof to form a wide passage communicating with said narrow passage.

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Lee et al., “A Monolithic Thermnal Inkjet Printhead Utilizing Electrochemical Etching and Two-Step Electroplating Techniques”, IEEE Transactions, Electron Devices Meeting, 1995, pp. 601-604, Dec. 10, 1995.
Chen et al., “A High-Resolution Silicon Monolithic Nozzle Array for Inkjet Printing”, IEEE Transactions on Electron Devices, Vo 44, No. 9, pp. 1401-1409, Sep. 1997.
Chen et al., “Parametric Study of InP Backside Processing Using High Density Plasma Etching”, International Conference on Indium Phosphide and Related Materials, 2000, pp. 186-189, May 2000.
U.S. Appl. No. 10/200,325, filed Jul. 23, 2002, Il Kim et al.

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