Interconnection pattern inspection method, manufacturing...

Details Interconnection pattern inspection method, manufacturing... Interconnection pattern inspection method, manufacturing...

2006-05-16

2006-05-16

Nghiem, Michael (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Dimensional determination

Reexamination Certificate

active

07047154

ABSTRACT:
A method of inspecting an interconnection pattern formed by depositing a metal onto a substrate having an interconnection pattern groove formed on a surface thereof includes: selectively measuring a thickness of a part above the substrate of a metal film formed on the substrate, the part above the substrate being a part constituted of the metal deposited upward from substantially the same surface as the surface of the substrate on which an interconnection pattern groove is formed; and evaluating how successfully the interconnection pattern groove is filled with the metal on the basis of a film thickness value obtained by the selective measurement.

REFERENCES:
patent: 6563308 (2003-05-01), Nagano et al.
patent: 6649516 (2003-11-01), Asakawa et al.
patent: 2559512 (1996-09-01), None
patent: 2570130 (1996-10-01), None
patent: APH10-154737 (1998-06-01), None
patent: P2001-156138 (2001-06-01), None
patent: 2001-313322 (2001-11-01), None
patent: P2001-343205 (2001-12-01), None

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