Photosensitive resin composition, porous resin, circuit...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Compositions to be polymerized by wave energy wherein said...

Reexamination Certificate

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Details

C522S162000, C522S134000, C522S135000, C522S144000, C522S173000, C522S176000, C522S903000, C522S915000, C522S142000, C521S061000, C521S062000, C521S077000, C521S137000, C521S134000, C521S135000, C521S136000, C521S138000, C521S140000, C521S139000, C427S335000, C427S336000, C427S337000, C427S352000, C428S473500

Reexamination Certificate

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07115673

ABSTRACT:
The present photosensitive resin composition2comprises a polyamic acid resin4, a photosensitive agent, a dispersible compound3dispersible in the polyamic acid resin4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition2to form a composition in which the dispersible compound3is dispersed in the polyamic acid resin4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

REFERENCES:
patent: 4532263 (1985-07-01), Krutchen et al.
patent: 4535100 (1985-08-01), Krutchen et al.
patent: 5972807 (1999-10-01), Tani et al.
patent: 6387969 (2002-05-01), Yamamoto et al.
patent: 6-322168 (1994-11-01), None
patent: 9-100363 (1997-04-01), None
patent: 10-45936 (1998-02-01), None
patent: WO 99/28787 (1999-06-01), None
Patent Abstracts of Japan (Publication No. 09/00363, Apr. 15, 1997).
XP-002160440-Abstract (1990).
European Search Report.

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