High speed circuitized substrate with reduced thru-hole...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

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Details

C174S260000, C361S780000, C333S012000, C029S846000, C029S852000

Reexamination Certificate

active

06995322

ABSTRACT:
A circuitized substrate including a plurality of conductive and dielectric layers and also a plurality of conductive thru-holes therein for passing high speed signals, e.g., from one component to another mounted on the substrate. The substrate utilizes a signal routing pattern which uses the maximum length of each of the thru-holes wherever possible to thereby substantially eliminate signal loss (noise) due to thru-hole “stub” resonance. A multilayered circuitized substrate assembly using more than one circuitized substrate, an electrical assembly using a circuitized substrate and one or more electrical components, a method of making the circuitized substrate and an information handling system incorporating one or more circuitized substrate assemblies and attached components are also provided.

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“Circuit-board design for 10-Gbit XFP optical modules”, by Williams et al, EDN Magazine, May 29, 2003.

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