Multi-substrate circuit assembly

Details Multi-substrate circuit assembly Multi-substrate circuit assembly

2006-06-20

2006-06-20

Cuneo, Kamand (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S255000, C174S252000, C428S209000

Reexamination Certificate

active

07064963

ABSTRACT:
Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

REFERENCES:
patent: 5936843 (1999-08-01), Ohshima et al.
patent: 6365964 (2002-04-01), Koors et al.
patent: 6625037 (2003-09-01), Nakatani et al.
patent: 6703564 (2004-03-01), Mori
patent: 6784554 (2004-08-01), Kajiwara et al.
patent: 6873043 (2005-03-01), Oman

Affiliated with

Also associated with

Rating

Multi-substrate circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-substrate circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-substrate circuit assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3637210