Packaging method of plasma display panel modules

Details Packaging method of plasma display panel modules Packaging method of plasma display panel modules

2006-06-13

2006-06-13

Gehman, Bryon P. (Department: 3728)

Special receptacle or package

For plate or sheet

Fragile or sensitive

C206S453000, C206S521000, C206S586000

Reexamination Certificate

active

07059473

ABSTRACT:
A panel module includes a panel in which a pair of substrates at least having a transparent front substrate is disposed facing each other with a discharge space in between and electrodes are disposed on substrates; a chassis for holding this panel; and a display driving circuit for applying a signal to the panel attached to the chassis for display. A resin front protective cover having substantially the same dimensions as a front frame of a finished plasma display device is provided on a periphery of the panel module for protecting the periphery of the panel module.

REFERENCES:
patent: 4333565 (1982-06-01), Woods
patent: 5002184 (1991-03-01), Lloyd
patent: 5465838 (1995-11-01), Hollander et al.
patent: 5584401 (1996-12-01), Yoshida
patent: 5779055 (1998-07-01), Lacy, III
patent: 6050417 (2000-04-01), Smith
patent: 6158590 (2000-12-01), Fujikawa et al.
patent: 6247986 (2001-06-01), Chiu et al.
patent: 6369501 (2002-04-01), Aoki et al.
patent: 6450850 (2002-09-01), Nunomura
patent: 0639505 (1995-02-01), None
patent: 7-326889 (1995-12-01), None
patent: 10-194344 (1998-07-01), None
patent: 11-59773 (1999-03-01), None
patent: 11-130143 (1999-05-01), None
patent: 2000-85847 (2000-03-01), None

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