Multilayer circuit board and method for manufacturing the same

Details Multilayer circuit board and method for manufacturing the same Multilayer circuit board and method for manufacturing the same

2006-11-07

2006-11-07

Lam, Cathy F. (Department: 1775)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S242000, C156S243000

Reexamination Certificate

active

07132029

ABSTRACT:
It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.

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