Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2006-08-15
2006-08-15
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S462000
Reexamination Certificate
active
07091062
ABSTRACT:
The invention relates to a wafer level package for chips with chip edge protection, comprising individual chips, which can in each case be mounted on a suitable carrier board, and to a method for producing such a wafer level package. Aspects of the invention can be achieved by the chip being thinned extremely from the back side and bonded onto a fiber reinforced synthetic resin sheet, forming a solidly bonded assembly that cannot come apart in the customary temperature range, and the edges of the assembly being at least partly coated with a polymer.
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Hoang Quoc
Infineon - Technologies AG
Nelms David
Slater & Matsil L.L.P.
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