Display device and manufacturing method thereof

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

Reexamination Certificate

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Reexamination Certificate

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07067395

ABSTRACT:
A technique for obtaining light emitting devices manufactured with high yield is provided. The width of a seal pattern (605b) can be kept thin by manufacturing a light emitting device using a second substrate (600a) which has a concave portion (607a) and a concave portion (608a). It therefore becomes possible to make the light emitting device have a narrow frame. In addition, the light emitting device with the narrow frame can be realized by a manufacturing method thereof in which a portion of the second substrate from the concave portion to an edge surface is cut.

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