Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2006-08-22
2006-08-22
Vinh, Lan (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S692000, C438S693000, C451S066000
Reexamination Certificate
active
07094695
ABSTRACT:
Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting at least one of a rotational velocity of the polishing pad, a downforce on the polishing pad, and a sweep velocity of the end effector in response to the monitored surface condition to provide a desired texture in the first region. In another embodiment, an apparatus for conditioning the polishing pad includes an end effector, a monitoring device, and a controller operatively coupled to the end effector and the monitoring device. The controller has a computer-readable medium containing instructions to perform a conditioning method, such as the above-mentioned method.
REFERENCES:
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081796 (1992-01-01), Schultz
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5234867 (1993-08-01), Schultz et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5244534 (1993-09-01), Yu et al.
patent: 5245790 (1993-09-01), Jerbic
patent: 5245796 (1993-09-01), Miller et al.
patent: RE34425 (1993-11-01), Schultz
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5449314 (1995-09-01), Meikle et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5533924 (1996-07-01), Stroupe et al.
patent: 5540810 (1996-07-01), Sandhu et al.
patent: 5616069 (1997-04-01), Walker et al.
patent: 5618381 (1997-04-01), Doan et al.
patent: 5626509 (1997-05-01), Hayashi
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5645682 (1997-07-01), Skrovan
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5658183 (1997-08-01), Sandhu et al.
patent: 5658190 (1997-08-01), Wright et al.
patent: 5664988 (1997-09-01), Stroupe et al.
patent: 5679065 (1997-10-01), Henderson
patent: 5702292 (1997-12-01), Brunelli et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5730642 (1998-03-01), Sandhu et al.
patent: 5747386 (1998-05-01), Moore
patent: 5779522 (1998-07-01), Walker et al.
patent: 5782675 (1998-07-01), Southwick
patent: 5792709 (1998-08-01), Robinson et al.
patent: 5795495 (1998-08-01), Meikle
patent: 5801066 (1998-09-01), Meikle
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5830806 (1998-11-01), Hudson et al.
patent: 5833519 (1998-11-01), Moore
patent: 5846336 (1998-12-01), Skrovan
patent: 5851135 (1998-12-01), Sandhu et al.
patent: 5868896 (1999-02-01), Robinson et al.
patent: 5879226 (1999-03-01), Robinson
patent: 5882248 (1999-03-01), Wright et al.
patent: 5893754 (1999-04-01), Robinson et al.
patent: 5895550 (1999-04-01), Andreas
patent: 5904615 (1999-05-01), Jeong et al.
patent: 5910043 (1999-06-01), Manzonie et al.
patent: 5930699 (1999-07-01), Bhatia
patent: 5934980 (1999-08-01), Koos et al.
patent: 5941761 (1999-08-01), Nagahara et al.
patent: 5945347 (1999-08-01), Wright
patent: 5954912 (1999-09-01), Moore
patent: 5967030 (1999-10-01), Blalock
patent: 5972792 (1999-10-01), Hudson
patent: 5975994 (1999-11-01), Sandhu
patent: 5980363 (1999-11-01), Meikle et al.
patent: 5981396 (1999-11-01), Robinson et al.
patent: 5994224 (1999-11-01), Sandhu et al.
patent: 5997384 (1999-12-01), Blalock
patent: 6004196 (1999-12-01), Doan et al.
patent: 6039633 (2000-03-01), Chopra
patent: 6040245 (2000-03-01), Sandhu et al.
patent: 6054015 (2000-04-01), Brunelli et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6074286 (2000-06-01), Ball
patent: 6083085 (2000-07-01), Lankford
patent: 6106371 (2000-08-01), Nagahara et al.
patent: 6110820 (2000-08-01), Sandhu et al.
patent: 6116988 (2000-09-01), Ball
patent: 6120354 (2000-09-01), Koos et al.
patent: 6135856 (2000-10-01), Tjaden et al.
patent: 6139402 (2000-10-01), Moore
patent: 6143123 (2000-11-01), Robinson et al.
patent: 6143155 (2000-11-01), Adams et al.
patent: 6152808 (2000-11-01), Moore
patent: 6176992 (2001-01-01), Talieh
patent: 6180525 (2001-01-01), Morgan
patent: 6187681 (2001-02-01), Moore
patent: 6191037 (2001-02-01), Robinson et al.
patent: 6193588 (2001-02-01), Carlson
patent: 6196899 (2001-03-01), Chopra et al.
patent: 6200901 (2001-03-01), Hudson et al.
patent: 6203404 (2001-03-01), Joslyn et al.
patent: 6203413 (2001-03-01), Skrovan
patent: 6206756 (2001-03-01), Chopra et al.
patent: 6210257 (2001-04-01), Carlson
patent: 6213845 (2001-04-01), Elledge
patent: 6214734 (2001-04-01), Bothra et al.
patent: 6218316 (2001-04-01), Marsh
patent: 6220934 (2001-04-01), Sharples et al.
patent: 6227955 (2001-05-01), Custer et al.
patent: 6234874 (2001-05-01), Ball
patent: 6234877 (2001-05-01), Koos et al.
patent: 6234878 (2001-05-01), Moore
patent: 6237483 (2001-05-01), Blalock
patent: 6238270 (2001-05-01), Robinson
patent: 6250994 (2001-06-01), Chopra et al.
patent: 6251785 (2001-06-01), Wright
patent: 6261151 (2001-07-01), Sandhu et al.
patent: 6261163 (2001-07-01), Walker et al.
patent: 6267650 (2001-07-01), Hembree
patent: 6273786 (2001-08-01), Chopra et al.
patent: 6273796 (2001-08-01), Moore
patent: 6273800 (2001-08-01), Walker et al.
patent: 6276996 (2001-08-01), Chopra
patent: 6284660 (2001-09-01), Doan
patent: 6306008 (2001-10-01), Moore
patent: 6306012 (2001-10-01), Sabde
patent: 6306014 (2001-10-01), Walker et al.
patent: 6306768 (2001-10-01), Klein
patent: 6312558 (2001-11-01), Moore
patent: 6328632 (2001-12-01), Chopra
patent: 6331139 (2001-12-01), Walker et al.
patent: 6331488 (2001-12-01), Doan et al.
patent: 6350180 (2002-02-01), Southwick
patent: 6350691 (2002-02-01), Lankford
patent: 6352466 (2002-03-01), Moore
patent: 6352470 (2002-03-01), Elledge
patent: 6354918 (2002-03-01), Togawa et al.
patent: 6354923 (2002-03-01), Lankford
patent: 6354930 (2002-03-01), Moore
patent: 6358122 (2002-03-01), Sabde et al.
patent: 6358127 (2002-03-01), Carlson et al.
patent: 6358129 (2002-03-01), Dow
patent: 6361411 (2002-03-01), Chopra et al.
patent: 6361413 (2002-03-01), Skrovan
patent: 6361417 (2002-03-01), Walker et al.
patent: 6364757 (2002-04-01), Moore
patent: 6368190 (2002-04-01), Easter et al.
patent: 6368193 (2002-04-01), Carlson et al.
patent: 6368194 (2002-04-01), Sharples et al.
patent: 6368197 (2002-04-01), Elledge
patent: 6376381 (2002-04-01), Sabde
patent: 6383934 (2002-05-01), Sabde et al.
patent: 6387289 (2002-05-01), Wright
patent: 6395620 (2002-05-01), Pan et al.
patent: 6402884 (2002-06-01), Robinson et al.
patent: 6419553 (2002-07-01), Koinkar et al.
patent: 6428386 (2002-08-01), Bartlett
patent: 6447369 (2002-09-01), Moore
patent: 6498101 (2002-12-01), Wang
patent: 6511576 (2003-01-01), Klein
patent: 6520834 (2003-02-01), Marshall
patent: 6533893 (2003-03-01), Sabde et al.
patent: 6547640 (2003-04-01), Hofmann
patent: 6548407 (2003-04-01), Chopra et al.
patent: 6579799 (2003-06-01), Chopra et al.
patent: 6592443 (2003-07-01), Kramer et al.
patent: 6609947 (2003-08-01), Moore
patent: 6609962 (2003-08-01), Wakabayashi et al.
patent: 6648728 (2003-11-01), Kojima et al.
patent: 6652764 (2003-11-01), Blalock
patent: 6666749 (2003-12-01), Taylor
patent: 6695680 (2004-02-01), Choi et al.
patent: 6769972 (2004-08-01), Huang et al.
patent: 6893336 (2005-05-01), Jin
Seiichi Kondo, Noriyuki Sakuma, Yoshio Homma, Yasushi Goto, Naofumi Ohashi, Hizuru Yamaguchi, and Nobuo Owada, “Abrasive-Free Polishing for Copper Damascene Interconnection”,Journal of the Electrochemical Society, 147 (10) pp. 3907-3913 (2000).
U.S. Appl. No. 10/910,690, filed Aug. 2, 2004, Mayes et al.
Micro)n Technology, Inc.
Perkins Coie LLP
Vinh Lan
LandOfFree
Apparatus and method for conditioning a polishing pad used... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for conditioning a polishing pad used..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for conditioning a polishing pad used... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3633305