Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1995-08-16
1997-04-15
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257718, 257722, 257726, 257727, H01L 2334
Patent
active
056212445
ABSTRACT:
A fin assembly for dissipating heat generated by an integrated circuit chip mounted on a socket having a pair of positioning ears disposed at two opposite sides thereof is disclosed. The fin assembly includes a fin and a pair of substantially L-shaped fastening members. The fin includes a bottom surface for contacting an integrated circuit chip and an upper surface from which a plurality of ridges extend upward along a length direction thereof. Each two adjacent said ridges define a channel therebetween and in one of the channels, at least one of two associated adjacent ridges has one extension extending toward the other ridge thereby defining a compartment having two opposite ends. Each of the fastening members comprises a first limb and a second limb. The first limb has a springing section formed adjacent to a joint of the first and second limbs and a flexible biasing section projecting from a free end thereof and extending toward said second limb. The biasing section of respective first limb is inserted into said compartment from the two opposite ends respectively and the biasing section has a height slightly greater than a height of said compartment. The second limb has an engaging slot defined therein adjacent to an arcuate free end thereof for cooperating with one of the positioning ears to thereby detachably lock the fin to the socket to ensure reliable surface contact between the integrated circuit chip and the fin.
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patent: 5475564 (1995-12-01), Chiou
Clark Jhihan
Saadat Mahshid
Ward Calvin B.
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