Semiconductor device and method for manufacturing the same,...

Details Semiconductor device and method for manufacturing the same,... Semiconductor device and method for manufacturing the same,...

2006-06-06

2006-06-06

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S738000

Reexamination Certificate

active

07057282

ABSTRACT:
A semiconductor device includes a semiconductor substrate including an integrated circuit and an electrode. A resin layer is provided on a side of the semiconductor substrate where the electrode is formed and a wiring layer is formed on an area reaching from the electrode to a top of the resin layer. The electrode has a first rim part facing a periphery of the semiconductor substrate and a second rim part facing a center region of the semiconductor substrate. The resin layer is formed so as to overlap the second rim part, leaving out an area from the periphery of the semiconductor substrate to the first rim part of the electrode.

REFERENCES:
patent: 6396145 (2002-05-01), Nagai et al.
patent: 2002/0008320 (2002-01-01), Kuwabara et al.
patent: 2004/0166660 (2004-08-01), Yamaguchi
patent: 08-124930 (1996-05-01), None
patent: 11-204678 (1999-07-01), None
patent: 11-224885 (1999-08-01), None
patent: 2000-349189 (2000-12-01), None
patent: 2001-077231 (2001-03-01), None
patent: 2002-016178 (2002-01-01), None
patent: 2002-016197 (2002-01-01), None
patent: WO00/55898 (2000-09-01), None

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