Method for producing module

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S842000, C029S843000, C029S832000, C228S180210, C228S180220

Reexamination Certificate

active

07032306

ABSTRACT:
The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced.

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Article: Leadless Bare attachment Technology for LOW-COST MCM-L By: Toshiyasu Shimada, Akihiro Dohya, Masaru Saitoh, Motoji Suzuki, Tuneaki Tajima, Teruyuki Kimura.

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