Method for repairing and assembling contact image sensor...

Details Method for repairing and assembling contact image sensor... Method for repairing and assembling contact image sensor...

2006-06-06

2006-06-06

Nguyen, Khiem (Department: 2839)

Electrical connectors

Miscellaneous

C439S076100, C439S763000, C029S831000, C029S402010, C358S482000

Reexamination Certificate

active

07056164

ABSTRACT:
A method for repairing and assembling contact image sensor module and structure thereof are provided. The method includes following steps: (1) making a sensor housing; (2) providing a PCB; (3) assembling the PCB into the sensor housing; (4) melting an end of a securing post located on the sensor housing and forming fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS, if it can't pass the test, then cut off the fastening means and take away the PCB for repairing or replacing it; (6) cutting off the securing post located on the housing; (7) making an adapted post with a securing tip and fixing said adapted post to a corresponding position of the sensor housing on which the former securing post being located; (8) assembling the repaired or replaced PCB into the sensor housing, and make the securing tip of the adapted post passing through the securing hole and extending outwardly from the PCB; (9) melting the tip of the adapted post by the manner of hot-press and forming a new fastening means for fixing the repaired or replaced PCB to the sensor housing again.

REFERENCES:
patent: 6729020 (2004-05-01), Brown et al.
patent: 6780067 (2004-08-01), Kono et al.
patent: 6840821 (2005-01-01), Bredow et al.
patent: 2003/0076552 (2003-04-01), Lo et al.

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