Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate
2006-06-06
2006-06-06
Schillinger, Laura M. (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
C257S782000, C257S783000
Reexamination Certificate
active
07057294
ABSTRACT:
Circuit elements are formed in a semiconductor chip (1) and an electrode pad (11) for connection with outside is formed on the periphery of a surface of the semiconductor chip (1). On the other hand, a wiring (21) is formed on one surface of an insulating substrate (2) and an external connecting terminal (22) is formed on the other surface thereof, being connected to the wiring (21). The electrode pad (11) of the semiconductor chip (1) and the wiring (21) are bonded by an Au—Sn alloy layer (3) at the connection section thereof. As a result, there is obtained a semiconductor device of a CSP type with a structure capable of connecting the semiconductor chip and the insulating substrate to each other without applying a large pressure and a high temperature thereto, and forming a circuit element even below the electrode pad and in the vicinity thereof to enable high integration.
REFERENCES:
patent: 4991001 (1991-02-01), Takubo et al.
patent: 5220486 (1993-06-01), Takubo et al.
patent: 5300811 (1994-04-01), Suzuki et al.
patent: 5317438 (1994-05-01), Suzuki et al.
patent: 5434452 (1995-07-01), Higgins, III
patent: 5461261 (1995-10-01), Nishiguchi
patent: 5604379 (1997-02-01), Mori
patent: 5775569 (1998-07-01), Berger et al.
patent: 5969426 (1999-10-01), Baba et al.
patent: 6046071 (2000-04-01), Sawai et al.
patent: 6104091 (2000-08-01), Ito et al.
patent: 6143991 (2000-11-01), Moriyama
patent: 6204564 (2001-03-01), Miyata et al.
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6489687 (2002-12-01), Hashimoto
patent: 6517698 (2003-02-01), Johnson et al.
patent: 09-213702 (1997-08-01), None
patent: 2000306948 (2000-11-01), None
patent: 2001-085595 (2001-03-01), None
patent: 2002110851 (2002-04-01), None
Office Action; document No.: 02-00283.
Rader & Fishman & Grauer, PLLC
Rohm & Co., Ltd.
Schillinger Laura M.
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3617304