Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-09-26
2006-09-26
Dickey, Thomas L. (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S015000, C365S222000
Reexamination Certificate
active
07112468
ABSTRACT:
An apparatus and method for fabricating a microprocessor comprising a first chip (12) having an active face (30) including a central processing unit and a second chip (14) having an active face (32) electrically connected to the active face of the first chip (12), wherein the second chip (14) provides added functionality to the central processing unit of the first chip (12) and wherein the electrical connections (16, 18) are through bonding layers (28) that are in contact with the metalization 26 on the first and second chips (12, 14), is disclosed.
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Chan Tsiu Chiu
Eng Lawrence Philip
Lepert Arnaud
Dickey Thomas L.
Jorgenson Lisa K.
Munck William A.
STMicroelectronics Inc.
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