Method of attaching a semiconductor chip to a chip mounting...

Details Method of attaching a semiconductor chip to a chip mounting... Method of attaching a semiconductor chip to a chip mounting...

2006-04-18

2006-04-18

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S827000, C029S825000, C156S521000, C438S118000

Reexamination Certificate

active

07028397

ABSTRACT:
A semiconductor chip, substrate employing plural bonding steps to ensure complete bonding particularly of peripheral edges. Embodiments include placing an adhesive layer on a chip mounting substrate positioned on a first supporting device, pressing a semiconductor chip against the chip mounting substrate to bond the semiconductor chip temporarily to the chip mounting substrate temporarily bonded chip on a second supporting device, and applying chip to straighten warpage and to bond the chip entirely to the chip mounting substrate.

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