SiGe lattice engineering using a combination of oxidation,...

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C438S692000, C428S641000

Reexamination Certificate

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07026249

ABSTRACT:
The present invention provides a method of fabricating a SiGe-on-insulator substrate in which lattice engineering is employed to decouple the interdependence between SiGe thickness, Ge fraction and strain relaxation. The method includes providing a SiGe-on-insulator substrate material comprising a SiGe alloy layer having a selected in-plane lattice parameter, a selected thickness parameter and a selected Ge content parameter, wherein the selected in-plane lattice parameter has a constant value and one or both of the other parameters, i.e., thickness or Ge content, have adjustable values; and adjusting one or both of the other parameters to final selected values, while maintaining the selected in-plane lattice parameter. The adjusting is achieved utilizing either a thinning process or a thermal dilution process depending on which parameters are fixed and which are adjustable.

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Tezuka, et al., “Fabrication of strained Si on an ultrathin SiGe-on-insulator virtual substrate with a high-Ge fraction”, Applied Physics Letters, vol. 79, No. 12, pp. 1798-1800, Sep. 17, 2001.

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