Method for mounting a plurality of spring contact elements

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

84, 84, C174S260000, C439S081000, C439S083000

Reexamination Certificate

active

07073254

ABSTRACT:
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.

REFERENCES:
patent: 3842189 (1974-10-01), Southgate
patent: 4480223 (1984-10-01), Aigo
patent: 4486945 (1984-12-01), Aigoo
patent: 4563640 (1986-01-01), Hasegawa
patent: 4615573 (1986-10-01), White et al.
patent: 4636722 (1987-01-01), Ardezzone
patent: 4916002 (1990-04-01), Carver
patent: 4965865 (1990-10-01), Trenary
patent: 5070297 (1991-12-01), Kwon et al.
patent: 5090118 (1992-02-01), Kwon et al.
patent: 5092783 (1992-03-01), Suarez et al.
patent: 5103557 (1992-04-01), Leedy
patent: 5166520 (1992-11-01), Prater et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5173055 (1992-12-01), Grabbe
patent: 5177438 (1993-01-01), Littlebury et al.
patent: 5191708 (1993-03-01), Kasukabe et al.
patent: 5210939 (1993-05-01), Mallik et al.
patent: 5228861 (1993-07-01), Grabbe
patent: 5323035 (1994-06-01), Leedy
patent: 5354712 (1994-10-01), Ho et al.
patent: 5382898 (1995-01-01), Subramanian
patent: 5424254 (1995-06-01), Damiot
patent: 5437556 (1995-08-01), Bargain et al.
patent: 5462440 (1995-10-01), Rothenberger
patent: 5465611 (1995-11-01), Ruf et al.
patent: 5476211 (1995-12-01), Khandros
patent: 5476818 (1995-12-01), Yanof et al.
patent: 5495667 (1996-03-01), Farnworth et al.
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5521518 (1996-05-01), Higgins
patent: 5555422 (1996-09-01), Nakano
patent: 5576630 (1996-11-01), Fujita
patent: 5629137 (1997-05-01), Leedy
patent: 5632631 (1997-05-01), Fjelstad et al.
patent: 5666190 (1997-09-01), Quate et al.
patent: 5723894 (1998-03-01), Ueno et al.
patent: 5742170 (1998-04-01), Isaac et al.
patent: 5772451 (1998-06-01), Dozier, II et al.
patent: 5786270 (1998-07-01), Gorrell et al.
patent: 5828226 (1998-10-01), Higgins et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5983492 (1999-11-01), Fjelstad
patent: 5994152 (1999-11-01), Khandros et al.
patent: 6029344 (2000-02-01), Khandros et al.
patent: 6059982 (2000-05-01), Palagonia et al.
patent: 6064213 (2000-05-01), Khandros et al.
patent: 6104087 (2000-08-01), DiStefano et al.
patent: 6117694 (2000-09-01), Smith et al.
patent: 6150186 (2000-11-01), Chen et al.
patent: 6174744 (2001-01-01), Watanabe et al.
patent: 6184053 (2001-02-01), Eldridge et al.
patent: 6475822 (2002-11-01), Eldridge et al.
patent: 6482013 (2002-11-01), Eldridge et al.
patent: 6499216 (2002-12-01), Fjelstad
patent: 2001/0015652 (2001-08-01), Eldridge et al.
patent: 2002/0117330 (2002-08-01), Eldridge et al.
patent: 2003/0199179 (2003-10-01), Eldridge et al.
patent: 42 31 704 (1992-09-01), None
patent: 0 315 358 (1989-05-01), None
patent: 396248 (1990-11-01), None
patent: 63062343 (1988-03-01), None
patent: 421650 (1990-12-01), None
patent: 3105258 (1991-05-01), None
patent: 518741 (1993-01-01), None
patent: 5164785 (1993-06-01), None
patent: 5281259 (1993-10-01), None
patent: 6018555 (1994-01-01), None
patent: 6265575 (1994-09-01), None
patent: 6267408 (1994-09-01), None
patent: 6273445 (1994-09-01), None
patent: 6313775 (1994-11-01), None
patent: 721968 (1995-01-01), None
patent: 763999 (1995-03-01), None
patent: 7260802 (1995-10-01), None
patent: 7333232 (1995-12-01), None
patent: 7333242 (1995-12-01), None
patent: 815318 (1996-01-01), None
patent: 821841 (1996-01-01), None
patent: 883413 (1996-03-01), None
patent: 470746 (1996-06-01), None
patent: WO 95/14314 (1995-05-01), None
patent: WO 96/02068 (1996-02-01), None
patent: WO 96/37332 (1996-11-01), None
patent: WO 97/43653 (1997-11-01), None

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