Method of fabricating mounted multiple semiconductor dies in...

Details Method of fabricating mounted multiple semiconductor dies in... Method of fabricating mounted multiple semiconductor dies in...

2006-03-07

2006-03-07

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S127000, C257S690000, C257S692000, C257S724000, C257S735000, C257S784000, C361S813000

Reexamination Certificate

active

07008824

ABSTRACT:
A semiconductor device includes multiple dies, in which a first die and a second die are mounted on a leadframe. The bond pads on the first and second dies are wirebonded to the leadframe. The first die, second die, and leadframe are encapsulated in a package.

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