Semiconductor package having semiconductor constructing body...

Details Semiconductor package having semiconductor constructing body... Semiconductor package having semiconductor constructing body...

2006-07-11

2006-07-11

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

C257S690000, C438S614000

Reexamination Certificate

active

07075181

ABSTRACT:
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating film covers the semiconductor constructing body. Each of interconnections which has a projecting electrode is formed on the insulating film. The projecting electrodes of the interconnection cut through the insulating film at portions corresponding to the external connection electrodes and electrically connected to the external connection electrodes.

REFERENCES:
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patent: 6559527 (2003-05-01), Brofman et al.
patent: 6770971 (2004-08-01), Kouno et al.
patent: 2003/0096454 (2003-05-01), Poo et al.
patent: 2004/0070064 (2004-04-01), Yamane et al.
patent: 2004/0195686 (2004-10-01), Jobetto et al.
patent: 2005/0098891 (2005-05-01), Wakabayashi et al.
patent: 2000-195890 (2000-07-01), None

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